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Уведомление о прекращении

  • Причина прекращения:

    Phase-out Reason(s): Due to product strategy adjustment, we recommend customers discuss the forecast with AAEON sales for future shipment or planning needs. After the last time buy date, these products will only be produced under certain conditions.We sincerely regret the disruption that may result from this notification. We will work closely with each customer to manage this EOL process as smoothly as possible.

    Last Buy Date: Dec. 03, 2024

    Recommend Product: UP Xtreme i12

UP Xtreme
compact embedded board
compact embedded board
up xtreme
compact embedded board
compact embedded board

The UP Xtreme is the third generation of UP Board products, powered by 8th Generation Intel® Core™ and Celeron® processors (formerly Whiskey Lake) with up to 16GB of onboard RAM and 64GB of eMMC memory to power through any application. With the latest Intel® graphics solution, the UP Xtreme is capable of 4K video output, and features a built-in audio jack as standard.

The UP Xtreme brings industrial grade features to the UP line of products, such as 12~60V wide voltage power input, two RS232/422/485 10-pin headers, and time sensitive networking (TSN) to facilitate communication in a connected factory. The UP Xtreme is also built to perform in temperatures ranging from 0°C up to 60°C.

The UP Xtreme offers flexible expandability with both a 40-pin and 100-pin connector, as well as m.2 2230 and 2280 slots, and mPCIe slots. The UP Xtreme can be expanded with wireless modules for Wi-Fi, Bluetooth, 4G and LTE. The UP Xtreme is compatible with other UP Board modules, including the AI Core X, AI Core XM 2280, and Vision Plus X, all featuring the Intel® Movidius™ Myriad™ X. With each module installed, the UP Xtreme supports up to six Intel® Movidius™ Myriad™ X modules, providing high-performance AI processing for edge computing applications.

Users can also get the UP Xtreme in a pre-built system, the UP Xtreme Edge (UPX Edge). The rugged UPX Edge can operate in conditions as cold as -20°C up to 70°C with the AI Core XM 2280 modules (two Intel® Movidius™ Myriad™ X VPUs).

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Accessories

Part Number Description
125530065A 19Vdc/3.42A.65W power adapter
1702031830 (TF)Power Cable.YP-12 3P.YC-14 3P.183c.for USA
1702031831 (TF)Power Cable.YP-22 3P.YC-14 3P.183cm.for European
9741364A00 (TF).M.2 2230 Wireless.802.11 ac/a/b/g/n + BT 5.0.2T2R,Enli QCNFA364A.w/2sets of cable and antenna
9741159H00 (TF)Wireless LAN kit.IEEE 802.11.b/g/n.w/BT 4.0/3.0.(AzureWave.AWNB159H).w/cable.& antenna (mini card)
PER-TAIX2-A10-2280 AI Core XM 2280.M.2 2280 B+M key card.with Dual Myriad X.15 mm heat sinkwith FAN
UPCR-CPL3-A11-001 Connect Plus.i211-AT.for UP core Plus/UP Xtreme
UPCR-CPL3-A11-002 Connect Plus.i210-IT.for UP core Plus/UP Xtreme, A.1
UPCR-CAN1-A10-0001 UP CAN Bus Carrier Board with USB/UART interface for UP product line
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