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Phaseout Notice

  • Phaseout Reason:

    Last Buy Date: Dec. 31, 2017

    Phase-out Reason(s): Due to the market trend and feedback, we regret to inform you that following product series and relate accessories are going to EOL. The future inquires will be built-to-order with minimum quantity required.

    Recommend Product(s): COM-SKHB6 or COM-KBHB6 series

COM-QM77 Rev. B
COM-QM77 Rev. B Top View
COM-QM77 Rev. B Bottom View

COM-QM77 Rev.B COM Express Type 6 module adopts low power 22nm monolithic BGA type Dual Core Intel® Core™ iSeries processors. Complimented by the Intel® QM77 PCH chipset, the COM-QM77 Rev.B module boasts superb graphic performance with hardware decoder and Intel® Clear Video HD technology, making it suitable for medical, gaming and multimedia applications. The wide temperature version features an operation range of -20°C – 70°C making it ideal for industrial and military applications.

The COM-QM77 Rev.B Basic type module measures at 125mm x 95mm and supports dual-channel SODIMM DDR3 1333/1600 with a maximum of 16GB memory. Expansion interfaces include one PCI Express&x#91;x16&x#93;, seven PCI Express&x#91;x1&x#93;, one LPC bus to connect to legacy I/O interfaces, one SMBus and two UART (TX/RX only). Eight USB2.0 and four USB3.0 support, two SATA 3.0Gb/s and two SATA 6.0Gb/s interfaces, Gigabit Ethernet interface with iAMT8.0 support, one 24-bit dual-channel LVDS and two additional video support for Full HD displays via HDMI, DVI or DisplayPort™, High Definition Audio, and 8-bit programmable GPIO are just some of the rich features packed into this small computer module. DirectX 11, OpenGL 3.1, OpenCL 1.1 and stereoscopic 3D are supported, enhancing up to 50% 3D graphics performance and up to 1.8X real time HD-HD transcode improvements. TPM v1.2 is available as an option for security conscious applications.

The use of a BGA type processor and a PCB thickness of 2mm, makes the COM-QM77 Rev.B more resistant to vibration and shock, enabling it to be used in devices on moving vehicles. Lowest TDP can be as low as 17W making it easier for thermal designs and increases stability under harsh environments. A matching Mini-ITX form factor carrier board, the ECB-917T is available for COM Express Type 6/10 modules upon request for fast implementation and evaluation purposes.

Applications

  • Healthcare
  • Industrial Automation
  • Security
  • Retail & Advertising
  • Test & Measurement
  • Gaming & Entertainment
  • Defense & Government
  • Digital Signage

Accessories

ECB-920A-A10-0001 COM Express Type 1/6/10 Carrier Board, Gigabit Ethernet, USB, 2 COM, 4 SATA, PCIe, AT/ATX, Legacy Free, Rev. A1.0
PER-A122 Heat Spreader, For COM-QM77, Onboard CPU
COM-FAN01 CPU Cooler, 125 x 95 x 26.4mm, Silver, use with HSP