- UP Boards and UP Systems
- UP Edge Computing Kit
- 11th Generation Intel® Core™ i7/i5 Processor SoC
UP XTREME I11 EDGE ENABLING KIT
11th Generation Intel® Core™ i7/i5 Processor SoC (formerly Tiger Lake UP3)
11th Gen Intel® Core™ Processor SoC
Core i7-1185GRE
Core i5-1145GRE
Core i7-1185GRE
Core i5-1145GRE
8GB 3200Hhz SO-DIMM modules x 2
Intel® Iris® Xe graphics
128GB 2.5” SSD x 1
Intel® i225IT (TSN) x 1, Intel® i219 (vPRO) x 1
Optional
M.2 2230 E-Key x 1
M.2 2280 M-Key x 1
M.2 3052 B-Key x 1 with SIM
M.2 2280 M-Key x 1
M.2 3052 B-Key x 1 with SIM
Preinstalled Software
Ubuntu 20.04 LTS and 5.11 Kernel
Intel® Distribution of OpenVINO™ toolkit 2021 R1
Intel® Media SDK
Intel® Distribution for Python*
MRAA and UPM I/O and sensor libraries for C++, Python*, Java*, and JavaScript*
Docker-CE
k3s Kubernetes
ONNX
AWS Greengrass
SQLite 3
Node.js
cmake
gcc
Openssl
Openssh-server/client
git
vim
tmux
Ubuntu 20.04 LTS and 5.11 Kernel
Intel® Distribution of OpenVINO™ toolkit 2021 R1
Intel® Media SDK
Intel® Distribution for Python*
MRAA and UPM I/O and sensor libraries for C++, Python*, Java*, and JavaScript*
Docker-CE
k3s Kubernetes
ONNX
AWS Greengrass
SQLite 3
Node.js
cmake
gcc
Openssl
Openssh-server/client
git
vim
tmux
USB3.2 Gen2 x 3
USB2.0 x 1 (Type A)
USB4.0 via USB type C
USB2.0 x 1 (Type A)
USB4.0 via USB type C
HDM 2.0 x 1 /DP 1.4 x 1
eDP x 1, 4K at 60hz panel
eDP x 1, 4K at 60hz panel
Intel® i225IT x 1, Intel® i219 (vPRO) x 1
—
Realtek ALC888s x 1 (Mic /Line out)
5.07 Ib (2.3kg)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90% relative humidity, non-condensing
CE,FCC Class A
