- 下架產品
- 插槽式單板計算機與背板
- 全尺寸單板電腦
- Full-Size SBC with Intel® 3rd Generation Core™ i
FSB-B75H
FSB-B75H - Slot SBC and Backplanes - PICMG Single Board Computers
SYSTEM
Form Factor
Full size CPU Card
Bus Interface
PICMG 1.3
CPU
LGA 1155 for Intel® Core™ i7/i5/i3 processor
Memory Type
Up to 16 GB (DDR 3 1333/1666 DIMM x 2)
Chipset
Intel® B75
BIOS
AMI
Wake on LAN
No
Watchdog Timer
Yes
Power Requirement
ATX 2.1
Power Consumption (Typical)
Intel® Core™ i7-3770 3.4 GHz, DDR3 8 GB
3.38A@+12V, 3.11A@+5V, 0.41A@+3.3V, 0.2A@5VSB, 58.45W (Full load)
3.38A@+12V, 3.11A@+5V, 0.41A@+3.3V, 0.2A@5VSB, 58.45W (Full load)
Dimension (L x W)
13.3" x 5" (339 mm x 126 mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
MTBF (hours)
60000
Certification
CE/FCC, Class A
DISPLAY
VGA/LCD Controller
Intel® B75
Video Output
Up to 2048 x 1536@75 Hz for CRT,
Up to 1920 x 1200 @ 60Hz for DVI (single link)
Up to 1920 x 1200 @ 60Hz for DVI (single link)
I/O
Ethernet
10/100/1000Base-TX x 2
USB Port
USB 3.0 x 4, USB 2.0 x 4
Serial Port
RS-232 x 1
RS-232/422/485 x 1
RS-232/422/485 x 1
Parallel Port
1
HDD Interface
SATA 3 x 1, SATA 2 x 2
FDD Interface
Optional
SSD
CFast™ x 1
Expansion Slot
PCI x 4, PCI-Express [x4] x 1, PCI-Express [x16] x 1 in backplane
DIO
8-bit programmable (4-in/4-out)
TPM
Audio
HDAC Daughter Board (optional) Mic-in/ Line-in/ Line-out
